Precision part traceability
Evaluate identification inside compact parts and products with limited mounting space.
ULTRA-SMALL / EMBEDDED IDENTIFICATION
A compact composite ceramic package brings RFID identification into precision parts, small assets and space-constrained products.

PRODUCT OVERVIEW
An RFID IC, conductive silver paste and alumina-glass composite ceramic form a compact identification package. Select the footprint and IC platform for the object and installation.
APPLICATIONS
Evaluate identification inside compact parts and products with limited mounting space.
Associate small objects with a digital record through the selected RFID reader and application.
Evaluate the package with your host material, assembly process and RF environment.
| Operating frequency | 865–928 MHz |
|---|---|
| Protocol | EPC Gen2 / ISO 18000-63 |
| IC platforms | M830 / R6-P / U9 / U8; confirm model-to-IC compatibility |
| Package material | Alumina-glass composite ceramic, conductive silver paste and RFID IC |
| Nominal thickness | 0.70 mm; released drawing governs final thickness and tolerance |
| Footprint series | 1.20 × 1.20 to 7.00 × 7.00 mm; see all seven sizes below |
Final dimensions, materials and IC compatibility require the released specification and sample qualification. Read range, metal compatibility, environmental ratings and assembly-process limits are not provided in the flyer; confirm them for the selected model. The seven footprints are a size series, not a guarantee of every IC in every size.
SIZE SERIES


PRODUCT DOCUMENTATION
Take the product information into your evaluation. Confirm the selected model and operating conditions with our team.